Garching – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is designed for high volume manufacturing and processing of 100mm to 300mm wafers. The platform ...This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category Sponsor AdWafer Processing Systems | Laser Machining |