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Samsung Introduces Full Line-Up Of LED Components Based On Chip-Scale Packaging Technology

2016-03-18 07:20:20| surfacefinishing News Articles

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, recently introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages

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