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Sealed, Fanless COM Express Compact Modules employ Skylake CPUs.

2015-09-09 14:31:08| Industrial Newsroom - All News for Today

Offering industry-grade driver implementations, conga-TC170 modules feature ULV-SoC editions of 6th Gen Intel® Core™ i3/i5/i7 (Skylake) CPUs, configurable TDP of 8.5–15 W, and up to 32 GB dual-channel RAM. Intel Gen 9 Graphics support 3 independently operated 4k displays with 60 Hz via DisplayPort 1.2, and version 2.0 of HDMI is also supported as well as version 12 of DirectX. COM Express Type 6 pinout-compliant interfaces include PEG, Gigabit Ethernet, 8x USB 2.0, LPC, I²C, and UART.

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Category:Industrial Goods and Services

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