Targeted for 2xnm and below etch applications, Primo iDEA™ integrates 4 dielectric etch stations and 2 photoresist strip chambers onto same platform. Integrative approach enables optimization of each process step and minimizes risk of plasma-induced damage. With dedicated dielectric etch and downstream ashing capabilities, offering is optimal for FEOL and BEOL applications involved in volume-producing complex, extremely small devices that are highly sensitive to manufacturing stresses.
This story is related to the following:Semiconductor Processing Equipment | Plasma Etching Systems