With 5.0 mm test height that provides total compression window of 0.8 mm and insertion loss of 18 GHz @ -1 dB (GSG), ZIP™ semiconductor test probe model Z-080YHJ targets high-lead count BGAs and LGAs and meets challenges associated with testing High End Digital (HED) devices. DUT side plunger, which is made from HyperCore™ homogenous alloy, features sharp, dual tip geometry for facilitated penetration of solder ball oxides. Product is based on flat probe technology.