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Solder Alloy meets needs of electronics assembly market.

2013-07-02 14:30:52| Industrial Newsroom - All News for Today

Offering optimal drop shock performance without compromises to thermal cycling, SACM™ has lead-free composition and consists of 97.5–98.5% Sn (tin), 0.5–1.0% Ag (silver), 0.5–1.0% Cu (copper), and dopant levels of Mn (manganese). Alloy is doped with manganese, which increases strength, while reduced silver content promotes stable cost structure. Properties include 5,625 psi tensile strength, 3,590 psi yield strength, 2110 King's Modulus (KSI), and 15.7% elongation. This story is related to the following:Lead-Free Alloys | Alloys

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