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Solder Joint Encapsulant for Ball Bumping Applications: BP 256

2014-09-22 06:00:00| Industrial Newsroom - All News for Today

Albany, NY &ndash; YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.<br /> <br /> YINCAE&#39;s BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating a solder joint bond that is 5-to-10 times stronger than a conventional solder joint. ...This story is related to the following:Adhesives and SealantsSearch for suppliers of: Reflow Encapsulants |

Tags: applications ball joint solder

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