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Solder Paste is suited for use on miniaturized assemblies.

2013-06-19 14:30:45| Industrial Newsroom - All News for Today

Suited for assemblers and OEMs of mobile phones and other personal electronics devices contending with sub-8 mil challenges, Indium8.9HFA halogen- and Pb-free solder paste optimizes print performance and mitigates common defects such as QFN voiding, head-in-pillow, and graping. Transfer efficiency lends to consistent, full volume print deposits (8 mil), while print pressure and response-to-pause conserve time on stencils and line changes. Print speed and wipe frequency reduce cycle time. This story is related to the following:Solder Paste

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Category:Industrial Goods and Services

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