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Speedline's MPM® EnclosedFlow(TM) Printing System Eliminates Solder Paste Compaction ...
2014-06-19 06:00:00| Industrial Newsroom - All News for Today
Franklin, Massachusetts, USA — Solder Paste compaction, a long-standing problem with pressurized enclosed media printing systems, has been eliminated with the MPM® EnclosedFlow™ printing system, it was announced today. The announcement follows a comprehensive program of exhaustive testing and customer production line evaluations. The EnclosedFlow was officially introduced to the market more than a year ago. Compaction of solder paste in an enclosed media system results, in part, ...This story is related to the following:Computer Hardware and PeripheralsSemiconductor Processing Equipment | Surface Mount Technology (SMT) Screen Printers
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Category:Industrial Goods and Services
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