Franklin, Massachusetts, USA — Solder Paste compaction, a long-standing problem with pressurized enclosed media printing systems, has been eliminated with the MPM® EnclosedFlow™ printing system, it was announced today. The announcement follows a comprehensive program of exhaustive testing and customer production line evaluations. The EnclosedFlow was officially introduced to the market more than a year ago. Compaction of solder paste in an enclosed media system results, in part, ...This story is related to the following:Computer Hardware and PeripheralsSemiconductor Processing Equipment | Surface Mount Technology (SMT) Screen Printers