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Speedline's Unique Open Apps Interface (OAI), Portal to Industry 4.0, to Be Featured at NEPCON China (Shanghai) and SMT Hybrid Packaging (Nuremberg)
2015-04-17 12:31:14| Industrial Newsroom - All News for Today
Franklin, Massachusetts, USA Speedline Technologies' unique patent-pending Open Apps, a revolutionary new 'open architecture' machine communications and control system, will be featured at the upcoming NEPCON China exhibition, Shanghai, in Stand B-1E20, April 21 23, and later at SMT Hybrid Packaging, Nuremberg...
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