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Home › Stencil for Solder Paste Printing increases yield, reduces waste.

 

Stencil for Solder Paste Printing increases yield, reduces waste.

2014-01-29 14:28:58| Industrial Newsroom - All News for Today

Developed to address electronic assembly industry demands, NanoSlic® Gold stencil features coating based on application process that coats both underside of stencil and aperture walls. Thermally cured and permanent coating is hydrophobic and oleophobic, which repels solder paste. Minimizing rework while increasing yields, properties promote solder paste transfer efficiencies for small apertures. Furthermore, properties minimize bridging and reduce underside cleaning. This story is related to the following:Stencils

Tags: increases printing waste yield

Category:Industrial Goods and Services

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