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Structural Engineer specialised in Electronic Packaging
2015-03-06 19:06:16| Space-careers.com Jobs RSS
Structural Engineer specialised in Electronic Packaging In a multidisciplinary engineering team, contribute to the development of stateoftheart spaceborne electronic units and subsystems by performing their structural analyses. Be part of a design team to evaluate numerically, analytically andor experimentally stiffness, strength and durability of spaceborne electronic equipment and subsystems. Identify problem areas, propose design modifications or improvements and subsequently approve the mechanical design. Support manufacturing, validate and prove the mechanical design by conducting mechanical tests according to the mechanical environments. Generate analysis reports as well as mechanical test plans reports. Experience skills The candidate should meet the following requirements Indepth knowledge of electronic components packaging techniques PCB, solders, vias, CCGA, thermal management, etc.. Ability to resolve manufacturing problems in electronic equipments. More than 4 years of direct experience in structural dynamics modal, sine, random analyses as well as thermoelastic analysis for electronic units and subsystems. Familiar with the fatigue life evaluation of electronic equipments More than 4 years of experience with NASTRAN. Ability to perform vibration, shock life tests. Experience in the space defense industry is an asset Experience with Nx CAE software is an asset. Education B.Sc. or the equivalent in Mechanical Engineering. M.Sc. is an asset. Ingnieur de structures spcialis en conditionnement lectronique Au sein dune quipe multidisciplinaire dingnieurs, contribuer llaboration dunits et de soussystmes lectroniques spatiaux la fine pointe de la technologie en effectuant leur analyse structurale. Faire partie dune quipe de conception afin dvaluer, au niveau numrique, analytique ou exprimental, la rigidit, la force et la durabilit de lquipement et des soussystmes lectroniques spatiaux. Identifier les zones problmatiques, proposer des modifications ou amliorations de conception et ensuite approuver la conception mcanique. Soutenir la fabrication, valider et prouver la conception mcanique en ralisant des essais mcaniques conformment aux environnements mcaniques. Produire les rapports danalyse ainsi que les rapports et plans dessai mcaniques. Exprience et comptences Le candidat doit rpondre aux exigences suivantes Connaissance approfondie des composants lectroniques et des techniques de conditionnement carte de circuits imprims, brasures, vias, CCGA, gestion thermique, etc.. Capacit rsoudre des problmes de fabrication dquipement lectronique. Plus de 4 ans dexprience directe en dynamique structurale analyses modale, sinusodale, alatoire ainsi quen analyse thermolastique pour units et soussystmes lectroniques. Connaissance de lvaluation de fatigue et de dure de vie de composants lectroniques Plus de 4 ans dexprience avec NASTRAN. Capacit deffectuer des essais de vibration, de rsistance aux chocs et de dure de vie. Lexprience dans lindustrie spatiale et de dfense est un atout. Lexprience avec le logiciel NX dingnierie assiste par ordinateur IAO est un atout. Niveau de scolarit B. Sc. ou quivalence en gnie mcanique, M. Sc., un atout.
Tags: electronic
packaging
structural
engineer
Category:Transportation and Logistics
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