Suitable for use in transmission electron microscopy (TEM) analysis, ExSolve™ can prepare site-specific, 20 nm thick TEM lamella on whole wafers up to 300 mm dia. Solution can sample many sites per wafer in fully automated process inside fab, and wafer TEM prep (WTP) increases speed of sample preparation. This provides semiconductor and data storage manufacturers with access to data needed to verify and monitor process performance. FOUP handling capability is standard.
This story is related to the following:Sample Preparation Equipment