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TSLC Introduces High Power LED Package for IR Solution

2014-04-03 06:00:00| Industrial Newsroom - All News for Today

Taiwan Semiconductor Lighting Company (TSLC) is developing packaging based on hybrid technology for wavelengths that range from UV lights with invisible short wavelengths to visible light with long wavelengths of blue, green, red, and IR. Most of the company&rsquo;s products are packaged on ceramic substrates and they have control over various ceramic substrate layout technology.<br /> <br /> Components that use ceramic package technology are highly reliable, have high emission power, and long ...This story is related to the following:Vision SystemsSurface Mount Device (SMD) LED's | Infrared Materials

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