Respectively offered in uDFN-6 and SOT23-6 packages, SP3012-03UTG and SP3012-04HTG protect sensitive chipsets with high-speed data lines from external ESD events (±12 kV min contact, ±25 kV min air). Form factor simplifies PCB layout by allowing traces to run directly underneath device and conserve board space. While clamping voltage promotes reliable equipment performance in field, capacitance of 0.5 pF minimizes signal degradation and distortion. Dynamic resistance is 0.4 Ω.<br />
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