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Technical Papers Take Top Honors at IPC APEX EXPO
2013-02-14 06:00:00| Industrial Newsroom - All News for Today
IPC announced winners of Best U.S. and International Papers of IPC APEX EXPO® 2013. Top honors in U.S. category went to "Double Reflow-Induced Brittle Interfacial Failures in Lead-Free Ball Grid Array (BGA) Solder Joints" by Julie Silk of Agilent Technologies. "Manufacturability and Reliability Screening of Lower Melting Point Lead-Free Alloys Containing Bismuth" by Polina Snugovsky, Ph.D., of Celestica Inc. was selected as best paper in International category. This story is related to the following:Trade Associations
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