Home › Texas Instruments expands in Chengdu, China, with - wafer bumping' operation
 

Keywords :   


Texas Instruments expands in Chengdu, China, with - wafer bumping' operation

2014-11-06 16:40:53| Semiconductors - Topix.net

TI late last night said it will add a 300 millimeter so-called "wafer bumping" facility to its operations in Chengdu in the Sichuan province of central China. Wafer bumping is an advanced process technology where "bumps" or balls made of a lead-free alloy are formed on the wafers before they're cut into chips.

Tags: china operation instruments texas

Category:Electronics and Electrical

Latest from this category

All news
»
03.07Summary for Hurricane Beryl (AT2/AL022024)
02.07Hurricane Beryl Graphics
02.07Hurricane Beryl Forecast Discussion Number 17
02.07Hurricane Beryl Forecast Advisory Number 17
02.07Ansell Completes Acquisition of Kimberly-Clarks PPE Business
02.07Ecolab Launches 100% Plastic-Free Wipe for Healthcare Settings
02.07Summary for Hurricane Beryl (AT2/AL022024)
02.07Chattanooga Area High School Students Graduate from BASFs TECH Academy
More »