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Texas Instruments expands in Chengdu, China, with - wafer bumping' operation
2014-11-06 16:40:53| Semiconductors - Topix.net
TI late last night said it will add a 300 millimeter so-called "wafer bumping" facility to its operations in Chengdu in the Sichuan province of central China. Wafer bumping is an advanced process technology where "bumps" or balls made of a lead-free alloy are formed on the wafers before they're cut into chips.
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Category:Electronics and Electrical
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