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Thermal Interface Material offers EMI absorption.

2015-08-21 14:31:06| Industrial Newsroom - All News for Today

With thermal conductivity of 1.0 W/m-K and EMI absorption for frequencies above 1 GHz, GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in flexible, gap filling product designed to exhibit exceptionally low stress on solder joints. Thermal conductivity is optimized by material’s natural tack on one side, which eliminates requirement for any thermally impeding adhesive layers and also facilitates component rework.

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Category:Industrial Goods and Services

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