Available in 7 ½ x 1 ¼ x 5/8 in. bars, Crystalbond™ 590 offers thermal and mechanical stability and is used to bond advanced ceramics, circuit boards, optical components, and semiconductors for dicing and polishing operations. Application is accomplished by preheating mounting plate to 300°F, melting and spreading adhesive in uniform layer, positioning part, and allowing assembly to cool. After machining, Crystalbond is dissolved in ultrasonic bath using isopropyl alcohol.
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