Home Thin Cooling Device eliminates hot spots in compact electronics.
 

Keywords :   


Thin Cooling Device eliminates hot spots in compact electronics.

2015-03-23 13:31:09| Industrial Newsroom - All News for Today

At <1 mm thick, thin loop heat pipe helps prevent overheating of localized parts due to heat generated from internal components in such small, thin electronic devices as smartphones and tablets. Heat-transfer device consists of evaporator and condenser connected by pipes into loop with encapsulated working fluid. Evaporator features six 0.1 mm thick copper sheets stacked together and contains porous structure with numerous holes driving fluid with capillary action.

Tags: hot electronics device compact

Category:Industrial Goods and Services

Latest from this category

All news

17.05Next MANAchat Series Scheduled for the Week of June 10
15.05Relationship Reviews Strengthening the Partnership Between Manufacturer and Rep
14.05Consolidated Financial Statements for the twelve-month period ended March 31, 2024
14.05Actions to Implement Management that is Conscious of Cost of Capital and Stock Price
Industrial Goods and Services »
20.05New ACA-Published Industry Market Analysis for the Paint & Coatings Industry Now Available
20.05Ulta Beauty Launches Same-Day Delivery with DoorDash
20.05Nivea Crmes Limited-Edition Pride Tin Heralds New Initiative with PFLAG
20.05Sheboygan Paint Company Appoints New Technical Sales Representative
20.05Scentair Adds Two Odor-Neutralizing Fragrances to its Auto Line Up
20.05GK Hair Unveils Summer 2024s Must-Have Hair Trends
20.05Revlon Taps Under Armour\'s Tchernavia Rocker As New Chief People Officer
20.05Canada invests over $9.6M to prevent, prepare for African swine fever
More »