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Thin Cooling Device eliminates hot spots in compact electronics.

2015-03-23 13:31:09| Industrial Newsroom - All News for Today

At <1 mm thick, thin loop heat pipe helps prevent overheating of localized parts due to heat generated from internal components in such small, thin electronic devices as smartphones and tablets. Heat-transfer device consists of evaporator and condenser connected by pipes into loop with encapsulated working fluid. Evaporator features six 0.1 mm thick copper sheets stacked together and contains porous structure with numerous holes driving fluid with capillary action.

Tags: hot electronics device compact

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