Along with current ratings from 0.15–5 A, fiberglass-enforced epoxy thin-film SMD chip fuses of T0603FF series offer low DCR (0.0095–2.200 Ω) and high in-rush current withstanding capability. Features include thin-film process technology and alloy-based metal fuse element design as well as 0.3 mm profile for height sensitive applications. Compatible with lead-free reflow soldering process, these lead (Pb)-free products target battery-powered applications.