SWITZERLAND – Tresky, a worldwide leading manufacturer of micro-assembly and rework applications, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.<br />
<br />
The T-6000 Die Bonder is an all-purpose system for R&D, pilot and medium-size production. Die handling is standard from wafer, ...This story is related to the following:Materials and Material ProcessingWafer Coating Equipment | Conductive Adhesive Bonders | Bonderizing Machinery