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True 3-D Chips Harness Nanotubes | EE Times
2014-12-19 21:02:53| Semiconductors - Topix.net
True three-dimensional chips were demonstrated recently at the 2014 International Electron Devices Meeting by Stanford University. Most 3-D chips use through-silicon-vias to stack separately manufactured dies, such as the Hybrid Memory Cube, which stacks DRAM die by Micron Technology, Inc., of Boise, Idaho.
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Category:Electronics and Electrical
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