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UV Cure Adhesive suits microelectronic assembly applications.
2013-05-31 14:31:38| Industrial Newsroom - All News for Today
Designed to eliminate any warpage of components in disk drive assemblies, nonconductive and ionically clean 535-18M-57 is also suited for lens bonding in camera modules, chip encapsulation in smart cards, and various general bonding applications in photonics assembly. Low-outgassing, flexible, high-strength epoxy adhesive cures when exposed to high-intensity UV light and does not contain antimony. Product offers minimal stress, shrinkage, and glass transition temperature values.<br /> <br /> This story is related to the following:Ultraviolet (UV) Adhesives |
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Category:Industrial Goods and Services