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Home › UV Cure Adhesive suits microelectronic assembly applications.

 

UV Cure Adhesive suits microelectronic assembly applications.

2014-04-08 14:31:44| Industrial Newsroom - All News for Today

Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony. This story is related to the following:Ultraviolet (UV) Adhesives |

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Category:Industrial Goods and Services

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