Developed to pass reliability requirements in disk drive, camera module, photonics, and circuit assembly applications, 535-11M-3 eliminates crowning (warpage) of sliders in Head Gimbal Assemblies. This non-conductive, low-outgassing, flexible adhesive does not contain antimony and can be used in other bonding applications in Head Stack Assembly as well as for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.