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UltraSource, Inc. Releases New Thin Film Microcircuit CopperVia
2013-01-10 04:45:39| wirelessdesignonline News Articles
Michael Casper, President & CEO of UltraSource, Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the newCopperVia, based on their existing patented UltraVia process.
Tags: film
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Category:Telecommunications
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