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Home › Unisem Announces QFN Side Wall Plating Capability And Leadframe Grid Array (LFGA) Package Offering

 

Unisem Announces QFN Side Wall Plating Capability And Leadframe Grid Array (LFGA) Package Offering

2014-09-12 13:25:20| surfacefinishing News Articles

Unisem, a global provider of semiconductor assembly and test services, recently announced its QFN side wall plating capability and LFGA package offering at the company’s facility located in Batam, Indonesia

Tags: side wall package offering

Category:Materials

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