In addition to 3-step profiling with principle of injection (5 with void reducing vacuum), CondensoXS vapor phase condensation reflow soldering system offers horizontal transport of assembled board to prevent components from slipping. Use of injection principle and control of temperature and pressure (vacuum) allow precise and diverse reflow profiling. Measuring complex requirements of lead-free soldering of units with high thermal mass, unit accelerates reliable solder of heavy units.
This story is related to the following:Vapor Phase Reflow Soldering Equipment