Featuring up to 140 contacts on 0.50 mm pitch, BEC5C Series suits high-speed applications requiring board space conservation. Dual beam bi-level contact system, staggered 0.5 mm pitch, reduces card mating force without reducing reliability. Available for 1.60 and 2.36 mm card thicknesses, socket features Phosphor Bronze contact, weld tabs, alignment pins, and lead-free solder crimp terminations. Tin-lead solder charges, as well as alternative platings and pin counts, are available.
This story is related to the following:Printed Circuit Connectors | Printed Circuit Sockets