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Visit Booth #1527 at the IPC APEX EXPO - PARMI to Showcase HS-70 Solder Paste Inspection System

2013-01-01 06:00:00| Industrial Newsroom - All News for Today

MARLBORO, MA - With more than 1,500 installations PARMI, a world leader in three-dimensional inspection of printed solder paste on PCBs, announces it will exhibit in booth #1527 at the IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. PARMI's SPI HS70 Series is a next-generation in-line solder paste inspection (SPI) system. The system hosts a number of features including measuring speed of 100cm²/sec and 10x10um resolution, ...This story is related to the following:Test and Measuring InstrumentsSolder Paste | Solder Paste Inspection Systems | Laser Engraving, Etching & Marking Inspection Systems |

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