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Wafer Backgrind/Polishing Services cover 300 mm processes.

2013-11-15 14:29:36| Industrial Newsroom - All News for Today

Made possible via Disco DAG 810 automatic grinder, wafer thinning services include 300 mm wafer backgrinding. This complements existing 300 mm dicing saws to provide comprehensive 300 mm die prep solution. Backgrind and polishing services cover polygrind to <50 µm on up to 300 mm wafers, individual die thinning, irregular shapes and wafer sizes, exotic materials (SiGe, GaN, GaAs, SiC, sapphire, glass), and multiple backside finishes and backgrind tapes. This story is related to the following:Wafer Processing Services | Wafer Grinding & Polishing Services

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