Able to be used as integral part of fabrication and packaging of integrated circuits or as part of QC and product acceptance, XM8000 provides automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS, and wafer bumps. Non-destructive, in-line wafer measurement covers voiding and fill levels, overlay, critical dimensions, and more.
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