Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes. In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack over time at various humidity levels.