Using Nordson DAGE patented Digital Tomosynthesis Technology, Model Xi3400 offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs, and packaged semiconductors. System acquires multiple images in different slice heights in one inspection cycle. Images can discriminate between components on top and bottom slices of double sided boards for unimpeded automated inspection.
This story is related to the following:Laboratory and Research Supplies and EquipmentX-Ray Inspection Systems | Printed Circuit Board (PCB) Inspection Systems | Assembly Verification Inspection Systems |