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YINCAE President, Dr. Wusheng Yin, Discusses Solder Joint Encapsulant and POP Assembly Solutions

2015-01-14 11:31:09| Industrial Newsroom - All News for Today

(Albany, NY)  YINCAE Advanced Materials LLC, is now published in the Global SMT Packaging Magazine for January 2015 titled, Solder Joint Encapsulant Adhesive-POP Assembly Solution. This article explains extensively about solder joint encapsulant adhesives in comparison to traditional solder paste and the positive...

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