Home eASIC Reduces Multi-Level Package Design Times with CST Microwave Studio
 

Keywords :   


eASIC Reduces Multi-Level Package Design Times with CST Microwave Studio

2014-01-23 12:33:50| rfglobalnet Home Page

This case study explains how CST MICROWAVE STUDIO electromagnetic simulation software helped predict the behavior of an eASIC integrated circuit and its package and PCB layout in the design phase.

Tags: times design studio package

Category:Telecommunications

Latest from this category

All news

»
24.11STEINBACH40
24.11 Sepua Crue F-170
24.11 SECRET
24.11CRAwith
24.1111/15)&&
24.11 8
24.11
24.11F2023 23
More »