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Wireless Communication Module is Bluetooth SMART compatible.

2016-03-01 14:31:04| Industrial Newsroom - All News for Today

Featuring Bluetooth® SIG certification, MK71050-03 integrates LAPIS Semiconductor's ML7105 wireless communication IC with 16 kB EEPROM, 26 MHz XO for master clock, and pattern antenna. Connection with host MCU is made via SPI, while commands and data format unique to LAPIS Semiconductor are implemented using 3 dedicated terminals: IRQ pin, WAKEUP pin, RF Active pin. Design has FCC certification in USA, construction design certification in Japan, and European compliance with R&TTE Directive.

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Huawei Introduces Short-Reach Optical Interconnect Module Prototype at the Optical Fiber Communication Conference and Exposition (OFC)

2015-04-03 12:31:14| Industrial Newsroom - All News for Today

LOS ANGELES, -- Huawei today unveiled its short-reach optical interconnect module prototype at the Optical Fiber Communication Conference and Exposition (OFC). A testament to Huawei's leading contributions in the optical network space, the 400 Gbit/s (16 x 25 Gbit/s) module is an industry-leading high-density...

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Alps Electric Launches the World's Smallest Automotive 4G LTE Communication Module Powered by Marvell's ARMADA Mobile Solution

2014-12-15 11:32:41| Industrial Newsroom - All News for Today

Marvell's ARMADA Mobile PXA1801 multi-mode 4G LTE modem is at the core of Alps' UMDZ Series high-speed data module with complete support of 2G, 3G and 4G LTE SANTA CLARA, Calif. Marvell (NASDAQ: MRVL) a worldwide leader in providing complete silicon solutions from mobile communications to storage, Internet of...

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I/O Module enables device/controller communication via IO-Link.

2014-04-15 14:30:35| Industrial Newsroom - All News for Today

Available for Simatic S7-1200 controller, IO-Link master module is based on IO-Link specification v1.1 and enables field devices connect to controller via IO-Link. Field device parameters are automatically backed up in controller, and all parameters are automatically transferred to new component if field device has to be replaced. Module supports rapid COM3 mode for accelerated response times or handling extensive data sets as well as supporting devices with v1.0 IO-Link specifications. This story is related to the following:I/O Modules

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