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Researchers present lower temperature version of ultra-high capacity molten air battery
2014-05-27 20:31:02| Green Car Congress
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RFMD(R) Scheduled to Present at Upcoming June 2014 Investor Conferences
2014-05-27 18:14:24| Semiconductors - Topix.net
GREENSBORO, N.C., May 27, 2014 -- RF Micro Devices, Inc. , a global leader in the design and manufacture of high-performance radio frequency solutions, today announced that Company executives are scheduled to present at two upcoming investor conferences: Bank of America Merrill Lynch 2014 Global Technology Conference, Wednesday, June 4, 2014 in San ... (more)
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Indium Corporation VP of Technology to Present at IUMRS-ICEM 2014
2014-05-27 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the International Union of Materials Research Societies – International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.<br /> <br /> Lee’s session, Development of High Temperature Lead-Free Solder Materials, will discuss the drivers of change for power semiconductor assembly materials and the ...
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PFSweb to Present at the 11th Annual Craig-Hallum Institutional Investor Conference on May 28, 2014
2014-05-22 07:18:14| Logistics - Topix.net
PFSweb, Inc. , an international provider of end-to-end eCommerce solutions, has been invited to attend the 11th Annual Craig-Hallum Institutional Investor Conference, which is being held on May 28, 2014 at the Minneapolis Marriott City Center Hotel in Minneapolis, MN.
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Indium Corporation Technology Expert to Present at Assembly, Cleaning, and Reliability Workshop
2014-05-22 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.<br /> <br /> Herron will present Various Ways to Minimize Voiding Under Bottom Terminated Components. This discussion will include the common challenge in SMT of voiding under bottom-terminated packages. Voids in the solder joints can lead to hot spots and component damage. Herron will ...
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