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Paradigm to Present Solutions for Unconventional Plays, G&G Interpretation, Geologic ...
2014-03-17 05:00:00| Industrial Newsroom - All News for Today
Solution demonstrations showcase high science, product integration and interconnectivity, and multi-user collaboration to ensure advanced science for everyone.<br /> <br /> HOUSTON - Paradigm® (<a href="http://www.pdgm.com">www.pdgm.com</a>) will feature its latest innovations at the 2014 American Association of Petroleum Geologists (AAPG) Annual Convention and Exhibition in Houston, April 6-9. Conference attendees are invited to join Paradigm at booth #1612 for live demonstrations featuring ...This story is related to the following:Data Communications Software | Scientific Software
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Donaldson to Present at the Bank of America Merrill Lynch Global Industrials and EU Autos Conference
2014-03-13 02:03:17| Paper - Topix.net
This presentation can be accessed live via webcast in the investors' section of Donaldson's website, www.donaldson.com .
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global
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bank
AGC Chemicals Americas to Present Benefits of FEVE Resins in Industrial Coatings
2014-03-12 06:00:00| Coatings World Breaking News
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industrial
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chemicals
RIEGL USA to Exhibit and Present at ASPRS 2014 Annual Conference
2014-03-11 05:00:00| Industrial Newsroom - All News for Today
RIEGL USA will be exhibiting and presenting at the ASPRS 2014 Annual Conference.<br /> <br /> The ASPRS 2014 Annual Conference will be held at the Galt House Hotel in Louisville, Kentucky from March 23 through March 28, 2014.<br /> <br /> RIEGL USA will also be exhibiting at Booth 601 during the conference. Please be sure to come by the booth to talk to our representative about any questions that you may have about our hardware and software solutions!<br /> <br /> Andres Vargas, Applications ...
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Indium Corporation Product Specialist to Present at IMAPS Device Packaging
2014-03-06 05:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in Scottsdale, Arizona.<br /> <br /> Durham’s presentation, Solderability Challenges in Emerging BGA Packages, details the sequence of processes seen in typical BGA assembly and examines the effects of each set of prior processes on the solderability of the final pad.<br /> <br /> For more information ...
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