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0.7-6 GHz Solid State Hybrid Power Amplifier Modules

2016-04-21 16:26:39| rfglobalnet Products

AR’s new line of Hybrid Power Module (HPM) products are now able to offer the ultimate performance over the wide 0.7 – 6 GHz frequency range in one compact, connectorized housing. These high gain 50 ohm modules provide 15 W of Class A output power, and are also available in a higher power 25 W class AB configuration when increased efficiency is required.

Tags: state power solid modules

 

Peregrine Semiconductor Expands MPACDoherty Product Family to Support GaN Power Amplifier Frequencies

2016-04-21 07:10:36| rfglobalnet Home Page

In booth #309 Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, introduces two UltraCMOS® MPAC–Doherty products—thePE46130andPE46140.

Tags: support family product power

 
 

MACOM Introduces Industry Leading Broadband MMIC Power Amplifier

2016-04-19 09:13:35| wirelessdesignonline News Articles

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic products, recently introduced the MAAP-011199, a gallium arsenide (GaAs) 3-stage pHEMT MMIC power amplifier.

Tags: power industry leading broadband

 

SkyLiTE Multimode Multiband Power Amplifier Module: SKY77652-11 Datasheet

2016-04-14 15:34:59| rfglobalnet Home Page

The SKY77652-11 SkyLiTE™ multimode multiband power amplifier module is designed to support 3G/4G handsets and operates efficiently in CDMA, WCDMA, TD-SCDMA and LTE modes. The module is fully programmable through a MIPI®, and is housed in a 28L MCM 3.65 x 4.0 x 0.75 mm package.

Tags: power module amplifier datasheet

 

SkyLiTE Multimode Multiband Power Amplifier Module: SKY77652-11 Datasheet

2016-04-14 15:34:59| wirelessdesignonline Downloads

The SKY77652-11 SkyLiTE™ multimode multiband power amplifier module is designed to support 3G/4G handsets and operates efficiently in CDMA, WCDMA, TD-SCDMA and LTE modes. The module is fully programmable through a MIPI®, and is housed in a 28L MCM 3.65 x 4.0 x 0.75 mm package.

Tags: power module amplifier datasheet

 

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