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Application of High Precision Thickness Tester in Packaging Material

2013-08-20 06:00:00| Industrial Newsroom - All News for Today

Abstract<br /> <br /> This article is to introduce the application of mechanical thickness tester in the thickness measurement of packaging material.<br /> KeywordF Mechanical thickness tester, non-contact method, pressure, presser foot, parallelism<br /> <br /> 1. Types of Packaging Materials<br /> At present, there are various types of package materials on the market such as metal, non-metal, glossy, matt, single layer, complex and co-extrusion packaging materials. For some expensive ...This story is related to the following:Test and Measuring InstrumentsThickness Testers | Packaging Supplies | Thickness Measurement Equipment | Thickness Measuring & Testing Instruments

Tags: high material application packaging

 

Hollow-Core Optical Fiber suits high precision gyroscopes.

2013-07-31 14:33:12| Industrial Newsroom - All News for Today

Employing air-filled core surrounded by glass webbing, Hollow-Core Fiber allows light to propagate through free space rather than solid glass core. Radiation hardened fiber can be bent and coiled to tight bend radius while guiding light. Single-spatial-mode forces light to take only single path, enabling high bandwidth and low noise. Orientation of light waves is fixed in fiber, which is necessary for applications such as sensing, interferometry, and secure communications. This story is related to the following:Optical Fibers

Tags: high optical precision fiber

 
 

Precision Castparts hits new high on big profits

2013-05-10 01:00:08| Industrial Machines - Topix.net

Precision Castparts rocketed to an all-time high in trading Thursday after breezing past Wall Street profit expectations for the fourth quarter.

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Single Wafer High Energy Implanter offers precision, throughput.

2013-05-09 14:30:36| Industrial Newsroom - All News for Today

Incorporating single wafer LINAC technology, Purion XE ion implanter enables high-yield manufacture of sub-16 nm planar and 3D devices. System incorporates 500+ wafers/hr end station and advanced filtration systems. Latter optimize beam purity, while angle control system and constant focal length scanning deliver precise and repeatable dopant placement. Scanned spot beam architecture enables control of damage engineering as well as other advanced processes. This story is related to the following:Laboratory and Research Supplies and EquipmentIon Implantation Systems | Ion Implanters | High Voltage Accelerators | Linear Accelerators

Tags: high single offers energy

 

Infineon introduces new line of ultra-small Hall sensors; high precision and high energy efficiency

2013-04-29 12:30:19| Green Car Congress

Tags: high line energy hall

 

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