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High-Speed Printers come in thermal inkjet/laser/MFP versions.

2013-05-16 14:30:27| Industrial Newsroom - All News for Today

Available to meet TEMPEST Level I and Zone requirements, network-ready and duplex-capable TEMPEST Level HP® Color LaserJet Printer produces up to 21 ppm. TEMPEST Level I Brother™ Color Inkjet Multifunction Printer/Scanner, accommodating paper sizes to 11 x 17 in., produces 33 ppm (black) and 25 ppm (color) and is available to meet TEMPEST Level 1 requirements only. TEMPEST Level I HP Officejet Mobile Printer (thermal inkjet printer) produces up to 22 ppm (black) and 19 ppm (color). This story is related to the following:Multifunction Printers | Laser Printers

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Thermal Printer Drivers support Linux and Mac OS X.

2013-05-16 14:30:25| Industrial Newsroom - All News for Today

Available for CL4e/CL6e, CG2/CG4, and M84Pro series printer models, SATO Printer Drivers integrate into Linux-based PC or Mac set-up for general purpose SOHO and enterprise-based printing functions utilizing CUPS printing system. Drivers support major Linux distributions, including Red Hat (.rpm), Ubuntu (.deb), and tar.gz for generic distribution installations. This story is related to the following:Printer Drivers

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Thermal Detector measures laser power, position, and size.

2013-05-15 14:30:33| Industrial Newsroom - All News for Today

Available with 12–50 mm aperture sizes, BeamTrack FL250A-BB-50-PPS measures power, beam position, and beam size of lasers up to 250 W. Unit also measures energy from 80 mJ to 300 J and provides information on beam centering and wander. Beam position is accurate to 0.2 mm and beam size is accurate to +/-5% for Gaussian beam. Capable of measuring spectral range from 150 nm to 20 µm, detector features Smart Connector interface that operates with StarLite, Nova II, and Vega smart displays. This story is related to the following:Sensors, Monitors and TransducersLaser Power Meters | Laser Beam Analyzers |

Tags: size power position measures

 

ULIS Launches Thermal Sensor Array Product Line, within Scope of European MIRTIC Project

2013-05-14 06:00:00| Industrial Newsroom - All News for Today

Project MIRTIC fulfils goal of producing a new type of affordable Infrared 2D array to overcome the limitations in single-element sensors<br /> <br /> ULIS will demonstrate Micro80P, the first in a new generation of thermal sensor arrays, at Sensor and Test in Nuremburg, Germany, May 14 - 16, 2013 at stand 12502.<br /> <br /> Veurey-Voroize, France &ndash; ULIS, a manufacturer of high quality infrared (IR) imaging sensors for thermography, security and surveillance, automotive and military ...This story is related to the following:Sensors, Monitors and TransducersGreen & CleanThermal Sensors | Image Sensors | Arrays

Tags: line product project european

 

Thermal Architect

2013-05-13 18:35:37| Space-careers.com Jobs RSS

Astrium brings space to you. Number 1 in Europe and number 3 worldwide, Astrium employs over 17,000 men and women mainly based in five European countries France, Germany, the UK, Spain and the Netherlands. Our technical excellence and extensive prime contractorship experience extend across all sectors of the space business launch vehicles, manned space activities, satellite systems and related services. A vacancy has arisen for a Thermal Architect with Astrium in Stevenage. The successful applicant will work on Scientific and Earth Observation spacecraft missions in the Astrium UK Mechanical, Thermal Propulsion System Engineering Department. The key responsibilities of the role are as follows Detailed spacecraft level thermal design and architecture. Definition of Thermal Control Subsystem TCS system level requirements and design. Management of TCS technical budgets. Definition of, and support to, system level thermal testing Definition and approval of requirements drawings. Preparation of design documentation. Management of thermal analysis activities and cost account management budget, schedule, risk, etc, Writing and review of thermal technical reports and specifications. Preparing inputs for equipment and system level thermal performance tests. Evaluation of equipment and system level test results. Costschedule support. Non Conformance ReportMaterial Review Board support at equipment and system level. System mechanicalelectricalTTCAOCS interfacing. Design reviewTest readinessTest Review Board support. The successful candidate will demonstrate the following skills and experience Extensive experience of thermal design and analysis at spacecraft level, ideally in scientific and earth observation missions. Working knowledge of the main European thermal design tools ESATAN, ESARAD, SYSTEMA would be an advantage. Experience of interfacing with other disciplines e.g. StructurePropulsionAOCSTTCoperations. Good communication and presentation skills. Experience of interfacing with both internal and external customers. Willingness to travel. TO APPLY click here

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