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Tag: applications
High-Temperature Sealant suits applications to 950°F.
2015-04-24 14:31:05| Industrial Newsroom - All News for Today
Formulated by combining high-temperature resin with ceramic fibers and powders, Pyro-Putty™ 950 can be used as gasketing compound for boilers, compressors, heat exchangers, furnaces, ovens, and exhaust manifolds. Product repairs rough, scored, or irregular surfaces and is resistant to chemical and steam attack, high pressure/vacuum atmospheres, mechanical vibration, and joint movement. Offered in 11 oz caulk gun cartridge, sealant can cure in service or by heating joint without pressure.
Tags: applications
suits
sealant
hightemperature
Longer Run-Times In View For Single-Cell Li-Ion Battery Applications As ams Launches 96%-Efficient 1A Buck Converter
2015-04-24 03:48:07| electronicsweb Home Page
ams AG, a leading provider of high performance sensors and analog ICs, recently introduced a 1A synchronous buck converter with the wide input voltage range, high efficiency and low stand-by current required in designs powered by a single-cell lithium-ion battery
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longer
applications
battery
Specialist Alloy Tubing Tackles Corrosion in Topside and Subsea Applications
2015-04-23 16:01:00| Offshore Technology
With oil and gas extraction moving into harsher and deeper environments, the demand for high-pressure and highly corrosion resistant tubing is rising.
Tags: applications
specialist
alloy
corrosion
Microporous Copper Foam suits heat sink applications.
2015-04-23 14:31:07| Industrial Newsroom - All News for Today
Featuring pore sizes from 300–600 µm and relative density of around 37%, Microporous Copper Foam is produced by means of lost carbonate sintering process. Rigid, highly porous, and permeable structure is regular and uniform throughout, and provides controlled density of metal per unit volume. Supplied in disks and sheet ranging in thickness from 4–10 mm, foam is suited for liquid cooling, air cooling, heat exchangers, EMI shielding, and power electronics applications.
Tags: applications
heat
copper
suits
DLP Chipset targets automotive head-up display applications.
2015-04-23 14:31:07| Industrial Newsroom - All News for Today
Combining DLP 0.3 in. WVGA digital micromirror device and DLPC120 controller, DLP3000-Q1 Chipset enables head-up displays with up to 12° field of view. Wide FOV HUD allows augmented-reality elements such as navigational indicators and real-time landmark details to be displayed in driver's line of sight, with depth perception of 2–20 m ahead. With chipset, HUDs can produce 15,000 cd/m² of brightness, 5,000:1 dynamic dimming, >1,000:1 FOFO contrast, and 125% NTSC color-gamut performance.
Tags: display
applications
automotive
targets
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