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Tag: applications
NI PXI Digitizer and LabVIEW Jitter Analysis Toolkit Increase Flexibility and Performance for Traditional Oscilloscope Applications
2013-01-27 01:00:00| National Instruments News
The software-defined nature of the NI PXIe-5162 digitizer and NI LabVIEW Jitter Analysis Toolkit demonstrates the flexibility and customization possible when engineers move beyond traditional box oscilloscopes.
Tags: increase
performance
analysis
applications
Servo Linear Actuator suits pick and place applications.
2013-01-25 14:30:33| Industrial Newsroom - All News for Today
Measuring 50 x 95 x 8 mm for 10 mm stroke, LCA8 Series is designed to replace pneumatic cylinders. Unit offers stroke range up to 50 mm, peak force of 5 N at 3 A, and acceleration up to >20 G. Providing independent control of position, speed, and force, actuator features standard encoder resolution of 5 microns, with 1 or 0.1 micron available as options. Direct drive actuator, available with vacuum shaft and spring option, is suited for pick and place and assembly applications. This story is related to the following:Linear Actuators |
Tags: place
applications
pick
linear
Finnish Energy Company Vantaa Energy Chooses IFS Applications 8
2013-01-24 17:45:00| Transmission & Distribution World
Vantaa Energy Ltd., one of Finlands largest urban energy companies, has chosen IFS Applications 8 to streamline its business processes.
Tags: company
applications
energy
finnish
HVLS Fans target high-end commercial applications.
2013-01-24 14:30:32| Industrial Newsroom - All News for Today
Manufactured in diameters from 8–20 ft with variety of custom colors, AirElite HVLS Fans combine ½ hp motor, onboard electronics, and fully integrated control system. Cohesive housing compartment powers 6 airfoil blades, which utilize NASA-engineered wing design. At 160 lb, fans offer low-profile installation for low ceiling heights, quiet operation, and ability to change perceptible room temperature by 5–15 degrees. This story is related to the following:Industrial Fans | Airfoil Fans
Tags: commercial
applications
target
fans
Die Attach Adhesive suits temperature-sensitive applications.
2013-01-24 14:30:31| Industrial Newsroom - All News for Today
Designed for attaching semiconductor die in temperature-sensitive devices, 561-50 Low Temperature Cure Adhesive is suited for smart cards, camera modules, and flex circuits. Electrically conductive product is more than 90% cured after 30 min at 80°C, but has dispensing work life greater than 48 hr, while maintaining optimized rheology for dispensing, damp heat resistance, and conductivity stability. Also, flexible material can be fast cured in 1 min at 180°C. This story is related to the following:Die Attached Adhesives |
Tags: die
applications
attach
suits
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