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Low-Profile Heatsinks enhance space-constrained designs.

2015-07-29 14:31:06| Industrial Newsroom - All News for Today

Optimized for deployment in streamlined, high-density electronic designs, LPH00xx series utilizes VersarienCu™ microporous copper technology and offers form factors that cover 10 x 10 x 2 mm through 40 x 40 x 5 mm. Microporous structure maximizes surface area and optimizes heat dissipation in space constrained designs. For applied load of 5 W, thermal resistance of 40 x 40 x 5 mm LPH0010 heatsink is 17.4°C/W, while 20 x 20 x 5 mm LPH0004 offers thermal resistance of 35.8°C/W for 2 W load.

Tags: designs enhance heatsinks lowprofile

 

Force Fabrication Inc.- Receives One Year Contract to Machine Dip-Brazed Heatsinks for Military Program

2015-04-29 12:31:13| Industrial Newsroom - All News for Today

Oxnard, CA Force Fabrication, an industry leader in precision sheet metal fabrication and manufacturing services for  telecommunications, medical, high technology, military/aerospace, announced today that they received a one year agreement to machine and assemble dip-brazed heatsinks for an ongoing military...

Tags: year program force machine

 
 

Stamped Heatsinks cool high-power LED lighting.

2015-02-02 14:32:03| Industrial Newsroom - All News for Today

Available in 3 power ratings of 100, 150, and 200 Watts, Igloo SS Series features rectangular profile and provides up to 0.53°C/W thermal resistance using stamping process. Heat pipe models dissipate heat from high-power CoB LEDs using evaporative technology, while non-heat pipe models are suitable for lighting fixtures with multiple CoB LEDs or Metal Core PCB LEDs. Number of fins can be tailored to fit LED fixture housing, and base mounting pattern can be customized to design specification.

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