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UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP

2015-03-17 11:31:13| Industrial Newsroom - All News for Today

Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global...

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UMC Broadens its 55nm eFlash Platform with Faraday's Silicon-proven IP

2015-03-12 11:40:50| Semiconductors - Topix.net

These IPs are designed to simultaneously meet both low-power and high-density requirements to satisfy the demands of a broad range of applications including IoT and wearable products. Low-power is prioritized for always-on devices in order to extend battery life.

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HED Launches the First 55nm Smart Card Chip Based on SMIC's 55nm LL eFlash Platform

2014-08-04 13:54:01| Semiconductors - Topix.net

Semiconductor Manufacturing International Corporation and CEC Huada Electronic Design Co., Ltd. jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL eFlash platform.

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HED Launches the First 55nm Smart Card Chip Based on SMIC's 55nm LL eFlash Platform

2014-08-04 06:00:00| Industrial Newsroom - All News for Today

SHANGHAI &mdash; Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) and CEC Huada Electronic Design Co., Ltd. ("HED") jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform. With the benefits of being smaller in size, lower power consumption and faster performance, it has been put into mass production and is being widely recognized by customers.<br /> <br /> SMIC's ...This story is related to the following:Automatic IDComputer Chips | Flash Memories

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UMC licenses 55nm flash memory for wearables

2014-07-15 16:28:49| IT Services - Topix.net

United Microelectronics Corporation has licensed embedded flash memory intellectual property from Cypress Semiconductor for the 55nm process technology node.

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