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Dangote joins sugar cane push in Nigeria

2013-09-05 09:14:31| Sugar Industry News

Abuja - Nigeria\'s biggest sugar refiner will spend $1.5 billion (R15.4bn) over the next five years on farming cane at home, responding to a government drive to make the country less reliant on its oil industry.

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Bryan Gregory joins Double E as chief executive

2013-09-05 07:00:00| Nonwovens Industry Breaking News

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ShuBee® Joins the Global Shipping Market

2013-09-04 06:00:00| Industrial Newsroom - All News for Today

ShuBee® Joins the Global Shipping Market Announces Availability to Ship to Over 90 Countries<br /> <br /> [Macon, GA] In an effort to bridge gaps in their shipping platform, ShuBee® has been working diligently to provide an international shipping solution that affords the most seamless experience possible to their clients.<br /> <br /> Chris Hood, e-Commerce Manager at ShuBee® has been heading up this initiative for months. &ldquo;One of the most exciting benefits of this new functionality on ...

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Linde's Peterson Joins CGA Natural Gas Technology Committee as Voting Member

2013-09-03 06:00:00| Industrial Newsroom - All News for Today

Murray Hill New Providence, N.J., U.S.,  &ndash; Gary Peterson, head of engineering and technology development, Energy Solutions for <a href="http://www.lindeus.com/en/index.html">Linde North America</a>, has been named the Linde voting member of the newly formed Natural Gas Technology Committee of the <a href="http://www.cganet.com/">Compressed Gas Association </a>(CGA). The committee was recently organized to develop safety standards related to compressed natural gas (CNG) and liquefied ...

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Dow Corning Joins EV Group's Open Platform for Temporary Bonding Materials for 3D-IC ...

2013-09-03 06:00:00| Industrial Newsroom - All News for Today

Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging<br /> <br /> ST. FLORIAN, Austria -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp&trade; platform for room-temperature wafer bonding and debonding processes. The ...This story is related to the following:Cyanoacrylate Debonders |

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