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Atotech Unveils New Through-Hole Fill System

2013-12-13 05:06:47| surfacefinishing News Articles

The Uniplate Cu InPulse 2 Advanced is suitable for all copper plating applications, and displays a very high flexibility, such as with BMV filling or super filling. It features the combination of two technologies: bridge plating – the accelerated plating in the holes’ centre forming two blind microvias on top and bottom – and super filling – the simultaneous copper plating and etching with Fe (III) on both microvias, leading to an inclusion-free TH-filling

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