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Toshiba Develops Two New Process Technologies For Microcontrollers And Wireless Communication ICs

2015-07-07 06:56:49| wirelessdesignonline News Articles

Toshiba Corporation recently announced that it has developed a flash memory embedded process based on 65nm logic process that uses less power than current mainstream technology, and a single-poly non-volatile memory (NVM) process based on 130nm logic and analog power process.

Tags: process communication technologies wireless

 

Optical Sensor ICs foster integration and innovation.

2015-06-24 14:31:07| Industrial Newsroom - All News for Today

Offered in single- or multiple-photodetector element configurations, LeddarCore™ sensor ICs offer optimized integration. Photodetector, pulsed light source, and optical elements enable development of applications with reliability, footprint, power, and robustness requirements. Used for optical detection and ranging devices, ICs are optimized for sensitivity, noise and lighting condition immunity, signal processing speed and accuracy regarding simultaneous measurements, and spatial awareness.

Tags: integration optical innovation foster

 
 

BGA Socket Adapter allows reliable socketing of ICs.

2015-06-09 14:31:05| Industrial Newsroom - All News for Today

With LS-BGA1924A-05 Adapter, users can convert compression mount BGA socket which needs mounting holes into conventional through-hole soldering options. Unit consists of machined Phosphorous Bronze pins pressed into FR4 wafer. Top side of adapter has gold plated pads to receive socket interconnect and bottom side has 0.008 in. diameter pin tails. Adapter can be soldered to any through-hole pattern using conventional soldering methods or plugged into mating female receptacle.

Tags: reliable adapter socket ics

 

Seiko Instruments Launches New High-Performance Hall Effect Sensor ICs Ideal For Automotive Applications

2015-06-05 05:31:10| autocentral Home Page

Seiko Instruments Inc. (SII) announced the release of the S-57P1 Series of bipolar latch type hall effect sensor ICs that is ideal automotive applications requiring high performance, reliability, and accuracy

Tags: effect applications automotive instruments

 

Design Models, IP, Kits help produce stable high-quality auto ICs.

2015-05-28 14:31:06| Industrial Newsroom - All News for Today

Available to IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and help chip designers capture such market opportunities as IoT and increased use of sensors.

Tags: design auto produce models

 

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